Multi-functional Integrated Optical Chip (Y‑Waveguide)

Overview

The Multi-functional Integrated Optical Chip (MIOC, also known as Y‑Waveguide) provides three key functions: polarization and analysis, beam splitting and combining, and electro‑optic phase modulation and compensation. It is a critical component that enables closed‑loop FOGs to achieve high sensitivity, wide dynamic range, and high output linearity.

This product features low insertion loss, high polarization extinction ratio, and high reliability across the full temperature range. It is fabricated using microelectronic and micro‑optic processes, combined with advanced coupling and packaging technologies. Operating wavelengths include 850nm, 1310nm, and 1550nm. Custom wavelengths and package styles are also available on request.

Technical Specifications

1310nm MIOC

Category	Parameter	Symbol	Unit	Typical Value
Optical	Center Wavelength	λc	nm	1290 ~ 1330
	Insertion Loss	IL	dB	≤ 3.5
	Full-Temp Insertion Loss Variation	ΔIL	dB	≤ 0.5
	Splitting Ratio	D	%	50 ± 2
	Full-Temp Splitting Ratio Variation	ΔD	%	≤ 3.0
	Return Loss	RL	dB	≤ -55
	Residual Intensity Modulation	RIM	—	≤ 1/1000
	PER at Room Temp	PER	dB	≤ -30
	Full-Temp PER	PERT	dB	≤ -25
Electrical	Half-Wave Voltage	Vπ	V	≤ 3.5
	Waveform Slope	S	—	≤ 1/250
	Bandwidth	BW	MHz	≥ 500
Package / Mechanical	Package Style	—	—	Metal or Ceramic
	Device Dimensions (excl. leads)	—	mm	30 × 8 × 5
	Fiber Pigtail Type	—	—	Small Mode Field (6.0μm) PM Fiber
	Fiber Pigtail Length	L	m	≥ 1.0
Environmental	Operating Temperature	Tw	°C	-45 ~ +70
	Storage Temperature	Ts	°C	-55 ~ +85

1550nm MIOC

Category	Parameter	Symbol	Unit	Typical Value
Optical	Center Wavelength	λc	nm	1530 ~ 1570
	Insertion Loss	IL	dB	≤ 3.5
	Full-Temp Insertion Loss Variation	ΔIL	dB	≤ 0.5
	Splitting Ratio	D	%	50 ± 2
	Full-Temp Splitting Ratio Variation	ΔD	%	≤ 3.0
	Return Loss	RL	dB	≤ -55
	Residual Intensity Modulation	RIM	—	≤ 1/1000
	PER at Room Temp	PER	dB	≤ -30
	Full-Temp PER	PERT	dB	≤ -25
Electrical	Half-Wave Voltage	Vπ	V	≤ 3.5
	Waveform Slope	S	—	≤ 1/250
	Bandwidth	BW	MHz	≥ 500
Package / Mechanical	Package Style	—	—	Metal or Ceramic
	Device Dimensions (excl. leads)	—	mm	30 × 8 × 5
	Fiber Pigtail Type	—	—	Small Mode Field (6.0μm) PM Fiber
	Fiber Pigtail Length	L	m	≥ 1.0
Environmental	Operating Temperature	Tw	°C	-45 ~ +70
	Storage Temperature	Ts	°C	-55 ~ +85